Multi-Layer PCB and Stack-up Design
PCB Design
Multi-Layer PCB and Stack-up Design
Designed by jointly evaluating layer stack-up, signal integrity, controlled impedance, EMI reduction, and thermal management requirements.
Intechron kapsamı
- Custom stack-up configurations from 4 to 32+ layers
- Controlled-impedance traces: microstrip, stripline, differential pairs
- Power and ground layer distribution
- HDI (High Density Interconnect) and micro-via design/modeling
- Back-drill and capped via (via-in-pad) applications
- Design rules per IPC-2221 / IPC-7351 classes
Our Work Process
How We Work
We systematically execute all engineering activities from needs analysis to operational acceptance in accordance with customer requirements, technical standards, and verification/test criteria.
01
Requirements Analysis & System Definition
Requirements Analysis & System Definition
02
Architecture Design
We integrate hardware, software, mechanical, and interface components into a holistic system architecture.
03
Detailed Design
We translate system architecture into production-ready electronic, software, and mechanical designs.
04
Prototype & Verification
We bring designs to life through prototypes, verifying functional and requirements compliance.
05
Test & Qualification
We subject products to functional, environmental, and performance testing in accordance with applicable standards.
06
Production
We transition validated designs to production based on quality, traceability, and repeatability principles.