The electromagnetic behavior of passive structures, connectors, and enclosure apertures on PCB is modeled with 3D EM simulation.
Intechron kapsamı
3D full-wave EM simulation (Ansys HFSS, CST Microwave Studio)
S-parameter extraction of connector and via structures
Aperture and chassis filtering effect assessment
Pre-compliance prediction of radiated emissions
Our Work Process
How We Work
We systematically execute all engineering activities from needs analysis to operational acceptance in accordance with customer requirements, technical standards, and verification/test criteria.